Hidden Failures in Automotive Electronics

In automotive electronics, even the smallest deviations or hidden defects can compromise the quality and reliability of entire assemblies. Dimensional deviations in the housing can complicate assembly, visible solder joints on the PCBA require fast and clear evaluation, hidden cracks in BGA solder joints are often difficult to detect with conventional methods, and sensitive connectors place high demands on non-contact precision metrology.

Each of these components brings its own risks and inspection requirements. That is why the right inspection solution is essential — from full-field 3D metrology and optical inspection to non-destructive analysis and precise non-contact measurement.

This allows manufacturers to detect defects earlier, make inspection processes more efficient, and safeguard quality in automotive electronics in a targeted way.

Highlights of this webinar:

- Detect hidden defects early from housing deviations to cracks in solder joints
- Understand the right inspection method for each component with precision and application-focused
- Safeguard quality sustainably – with the right combination of metrology and software

Register here.